Metallized Ceramic Components
Four-Hole Metallized Ceramic Insulator
Four-Hole Metallized Ceramic Insulator,Custom four-hole alumina ceramic insulator with Mo–Mn metallization and optional plating for ceramic-to-metal brazing and electrical assemblies.
Description
TecCera supplies custom Four-Hole Metallized Ceramic Insulator,four-hole metallized alumina ceramic insulators designed for ceramic-to-metal brazing, electrical isolation and sealed connection assemblies. The circular ceramic body incorporates four metallized through-holes and a metallized outer perimeter, allowing metal sleeves, conductors or housings to be joined to the ceramic.
The metallized areas use a molybdenum–manganese (Mo–Mn) base layer with optional nickel, copper, silver or gold plating. Component dimensions, hole patterns, metallization areas and plating finishes can be customized according to customer drawings.
Product Overview
|
Item |
Specification |
|
Product Name |
Four-Hole Metallized Alumina Ceramic Insulator |
|
Ceramic Material |
95%, 96% or 99% alumina (Al₂O₃) |
|
Configuration |
Circular ceramic body with four through-holes |
|
Base Metallization |
Molybdenum–manganese (Mo–Mn) |
|
Metallization Thickness |
15–25 μm |
|
Optional Plating |
Nickel, copper, silver or gold |
|
Plating Thickness |
8–10 μm |
|
Joining Method |
Ceramic-to-metal brazing or soldering |
|
Dimensions |
Manufactured according to customer drawings |
|
Brand |
TecCera |
Detailed Product Information
The ceramic body provides electrical insulation, mechanical support and dimensional stability. Selected surfaces—including the four through-holes and outer perimeter—can be coated with Mo–Mn metallization to create bondable interfaces for subsequent ceramic-to-metal joining.
An optional plating layer can be applied over the Mo–Mn metallization to improve brazability, solderability and surface protection. The hole diameter, pitch-circle diameter, ceramic thickness, outer diameter, metallization pattern and plating finish can all be customized.
Available Surface Configurations
- Mo–Mn metallization without additional plating
- Mo–Mn metallization with nickel plating
- Mo–Mn metallization with copper plating
- Mo–Mn metallization with silver plating
- Mo–Mn metallization with gold plating
- Selective metallization according to customer drawings
- Alternative hole quantities and patterns available
Typical Applications
- Multi-pin electrical feedthrough assemblies
- Ceramic-to-metal sealed connectors
- Electrical headers and terminal assemblies
- Vacuum equipment components
- High-voltage insulating assemblies
- Sensor and instrumentation packages
- Power electronic modules
- X-ray and microwave equipment components
- Custom ceramic-to-metal brazed assemblies
Key Features
- High electrical insulation and dielectric performance.
- Four metallized through-holes for joining metal sleeves or conductors.
- Dense and uniform Mo–Mn metallization layer.
- Good brazability and solderability after suitable plating.
- Good mechanical strength and dimensional stability.
- Resistance to wear, corrosion and demanding operating environments.
- Custom hole patterns, dimensions and metallization areas available.
- Optional nickel, copper, silver and gold plating.
Custom Manufacturing
Please provide the following information for technical evaluation:
- Component drawing or required dimensions
- Alumina purity
- Hole quantity, diameter and position
- Metallization areas and thickness
- Required plating material and thickness
- Mating metal material
- Operating temperature and electrical requirements
- Quantity and inspection requirements
Request a Quote
Send TecCera your drawings, specifications and required quantity. We will evaluate the ceramic material, metallization pattern, plating finish and joining requirements for your application.
Technical Specifications
| Parameter | Typical Value / Range | Unit |
|---|---|---|
| Alumina Purity | 95%, 96% or 99% | % |
| Bulk Density | ≥ 3.63 | g/cm³ |
| Thermal Conductivity at 25°C | 22.45 | W/m·K |
| Coefficient of Thermal Expansion, 20–1000°C | 8.26 | ×10⁻⁶/K |
| Flexural Strength | ≥ 340 | MPa |
| Dielectric Strength | ≥ 8.3 | kV/mm |
| Dielectric Constant at 1 MHz | 9.1 | — |
| Dielectric Loss at 1 MHz | ≤ 0.0004 | — |
| Mo–Mn Metallization Thickness | 15–25 | μm |
| Optional Plating Thickness | 8–10 | μm |
Technical Resources
Download the TecCera brochure for metallized alumina components, ceramic-to-metal brazed assemblies, hermetic seals, and vacuum feedthrough solutions.
Download Metallized Ceramics Brochure (PDF)How to Get a Quote
Send us your drawing or technical requirements. We will review the material, dimensions, tolerances and application conditions before quotation.
- Inquiry
- Technical Review
- Quotation
- Order
Need a Custom Ceramic Component?
Send us your drawing, dimensions, material requirements, quantity and application conditions.
Request a Quote