Metallized Ceramic Components
Four-Hole Metallized Ceramic Component
Four-Hole Metallized Ceramic Component
Overview
TecCera supplies custom four-hole metallized ceramic components manufactured from high-purity alumina for electrical insulation, vacuum sealing, ceramic-to-metal joining, and high-voltage applications.
The four-hole structure provides multiple isolated passages for electrical conductors, terminals, pins, or other functional elements within a compact ceramic body.
Mo/Mn metallization can be selectively applied to designated surfaces, followed by optional nickel, copper, gold, or silver plating to support brazing, bonding, sealing, or electrical connection.
Custom dimensions, hole diameters, hole spacing, metallization areas, and plating systems are available according to customer drawings.
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Typical Technical Specifications
|
No. |
Parameter |
Typical Value / Specification |
Unit |
|
1 |
Alumina Purity |
95%, 96% or 99% |
% |
|
2 |
Bulk Density |
≥ 3.63 |
g/cm³ |
|
3 |
Thermal Conductivity (25°C) |
22.45 |
W/m·K |
|
4 |
Coefficient of Thermal Expansion (20–1000°C) |
8.26 × 10⁻⁶ |
/°C |
|
5 |
Flexural Strength |
≥ 340 |
MPa |
|
6 |
Dielectric Strength |
≥ 8.3 |
kV/mm |
|
7 |
Dielectric Constant (1 MHz) |
9.1 |
— |
|
8 |
Dielectric Loss (1 MHz) |
≤ 0.0004 |
— |
|
9 |
Metallization Layer |
Mo/Mn, 15–25 |
μm |
|
10 |
Plating Layer |
Ni / Cu / Au / Ag, typically 8–10 |
μm |
Note: Actual ceramic properties and coating specifications may vary depending on alumina grade, geometry, metallization design, and application requirements.
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Four-Hole Design
The four-hole ceramic configuration can be customized according to the customer’s electrical and mechanical design.
Available customization may include:
- Hole diameter
- Hole spacing
- Overall ceramic diameter
- Ceramic thickness
- Through-hole or stepped-hole structures
- Metallized surface areas
- Metallized hole edges
- Metallized end faces
- Dimensional tolerances
- Surface finish
- Plating material and thickness
This design is suitable for applications requiring several electrically isolated conductors or feedthrough channels within a single ceramic component.
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Materials & Surface Finish
Ceramic Material
95%, 96%, or 99% Alumina (Al₂O₃)
Base Metallization
Mo/Mn
Typical Metallization Thickness
15–25 μm
Optional Plating
Nickel (Ni), Copper (Cu), Gold (Au), Silver (Ag)
Typical Plating Thickness
8–10 μm
Color
White ceramic with metallic metallized surfaces
Configuration
Four-hole structure, customizable according to drawing
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Key Features
Multiple Electrically Isolated Passages
The four-hole design allows multiple conductors or terminals to pass through a single ceramic body while maintaining electrical isolation.
Excellent Electrical Insulation
High-purity alumina provides strong dielectric performance for high-voltage and electrically demanding applications.
Reliable Metallization
Mo/Mn metallization creates a metallic interface suitable for subsequent plating and ceramic-to-metal joining.
Good Brazing Compatibility
Nickel-plated metallized surfaces are commonly used for brazing ceramic components to compatible metal structures.
High Mechanical Stability
Alumina provides good rigidity, dimensional stability, and mechanical strength.
Suitable for Vacuum Applications
Metallized ceramic components can be incorporated into hermetic and vacuum assemblies when properly brazed and sealed.
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Typical Applications
Four-hole metallized ceramic components can be used in:
- Multi-pin electrical feedthroughs
- Vacuum feedthrough assemblies
- Hermetic electrical connectors
- High-voltage terminals
- Ceramic headers
- Relay components
- Sensor feedthroughs
- Vacuum electronic devices
- RF and microwave assemblies
- Medical equipment
- Aerospace electrical systems
- Power electronic modules
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Metallization Options
- Kovar
- Stainless steel
- Copper
- Nickel
- Nickel-iron alloys
- Molybdenum
Typical structures include:
Alumina + Mo/Mn Metallization + Nickel Plating
A common solution for ceramic-to-metal brazing and hermetic sealing.
Alumina + Mo/Mn Metallization + Gold Plating
Suitable for selected high-reliability or corrosion-resistant electrical applications.
Alumina + Mo/Mn Metallization + Silver Plating
Available for selected bonding and conductive applications.
Alumina + Printed Silver
Can be used for specific conductive ceramic applications depending on design requirements.
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Ceramic-to-Metal Joining
Four-hole metallized ceramic parts can be designed for joining with compatible metal components such as:
Material selection should take into account thermal expansion matching, operating temperature, vacuum level, electrical requirements, and mechanical loading.
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Custom Manufacturing
TecCera supports custom manufacturing according to customer drawings.
For technical evaluation, please provide:
- 2D or 3D drawing
- Overall dimensions
- Hole diameter
- Hole spacing
- Ceramic purity
- Dimensional tolerances
- Metallization area
- Metallization thickness
- Plating material
- Plating thickness
- Mating metal material
- Operating voltage
- Operating temperature
- Vacuum or leak-rate requirements
- Estimated quantity
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Request a Quote
Looking for a custom four-hole metallized ceramic component?
Send us your drawing, dimensions, hole configuration, ceramic grade, metallization requirements, plating specification, and estimated quantity for evaluation and quotation.
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Technical Resources
Download the TecCera brochure for metallized alumina components, ceramic-to-metal brazed assemblies, hermetic seals, and vacuum feedthrough solutions.
Download Metallized Ceramics Brochure (PDF)How to Get a Quote
Send us your drawing or technical requirements. We will review the material, dimensions, tolerances and application conditions before quotation.
- Inquiry
- Technical Review
- Quotation
- Order
Need a Custom Ceramic Component?
Send us your drawing, dimensions, material requirements, quantity and application conditions.
Request a Quote