DPC 96% Alumina Ceramic Circuit Board

TecCera supplies custom DPC 96% alumina ceramic circuit boards for applications requiring electrical insulation, thermal stability, precision copper circuits and reliable operation under demanding conditions.

This product uses a 96% alumina (Al₂O₃) ceramic substrate with a thickness of 2.0 ± 0.05 mm, approximately 70 μm copper thickness, through-hole structures and an immersion gold surface finish.

The DPC process enables copper circuits to be formed directly on the ceramic substrate, making it suitable for compact electronic assemblies where conventional FR-4 boards may not provide sufficient thermal stability, electrical insulation or mechanical rigidity.

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Typical Product Specifications

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Key Advantages

Excellent Electrical Insulation

96% alumina ceramic provides reliable dielectric insulation while maintaining good thermal and mechanical stability.

This makes it suitable for electronic circuits requiring:

• Electrical isolation
• High-voltage separation
• Stable dimensions
• Low moisture absorption
• Long-term reliability

Compared with conventional organic PCB materials, alumina ceramic remains mechanically and electrically stable across a broader range of demanding operating environments.

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Improved Thermal Performance

Typical 96% alumina ceramic offers thermal conductivity of approximately:

20–30 W/m·K

depending on ceramic composition and test conditions.

This is substantially higher than conventional FR-4 and helps transfer heat away from electronic components.

For applications requiring even higher heat dissipation, aluminum nitride ceramic can be considered as an alternative.

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70 μm Copper Circuit

This configuration uses approximately:

70 μm copper thickness

providing a balance between circuit precision and current carrying capability.

The copper thickness can be adjusted according to:

• Circuit geometry
• Current requirements
• Thermal requirements
• Pad dimensions
• Assembly process

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Through-Hole Capability

The product supports through-hole structures with a typical minimum diameter of:

0.8 mm

Through holes can be used for:

• Mechanical mounting
• Electrical interconnection
• Component positioning
• Terminal structures
• Assembly alignment

Hole dimensions and tolerances should be defined according to the customer drawing.

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DPC Processing Capabilities

TecCera can support customized DPC ceramic circuit boards according to customer drawings and application requirements.

Typical capabilities include:

• Fine copper circuit patterning
• Single-sided circuits
• Double-sided circuits where applicable
• Through holes
• Microvias
• Via filling
• Customized copper thickness
• Custom ceramic outlines
• Customized pad geometry
• Selective metallization
• Surface finishing
• Precision dimensional control

Typical fine circuit capability can reach approximately:

3 mil / 3 mil

depending on copper thickness, substrate material, pattern geometry and manufacturing requirements.

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Available Ceramic Thicknesses

Typical ceramic substrate thickness options include:

• 0.25 mm
• 0.38 mm
• 0.50 mm
• 0.635 mm
• 1.0 mm
• 1.5 mm
• 2.0 mm
• 2.5 mm
• 3.0 mm

Other thicknesses can be evaluated based on project requirements.

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Surface Finish Options

Different surface finishes can be selected according to soldering, bonding, contact and environmental requirements.

Typical options include:

• Immersion gold
• Gold plating
• Nickel plating
• Ni/Pd/Au
• Silver plating
• Immersion tin

For this configuration:

Surface Finish: Immersion Gold

The final plating stack and thickness should be specified according to the assembly process.

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96% Alumina Material Advantages

96% alumina is one of the most widely used technical ceramic materials for electronic substrates because it provides a practical balance of performance and cost.

Typical advantages include:

• Good thermal conductivity
• High electrical insulation
• High mechanical strength
• High hardness
• Good dimensional stability
• Low moisture absorption
• Chemical resistance
• High-temperature stability

It is particularly suitable for applications where AlN-level thermal conductivity is not required.

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