Aluminum Nitride Ceramics
Aluminum Nitride Ceramic Substrate
Component Types
Detailed Product Information
Typical Technical Properties
|
Parameter |
Typical Value |
|
AlN content |
Grade dependent; confirm before ordering |
|
Oxygen content |
Grade dependent |
|
Thermal conductivity |
170–200 W/(m·K) |
|
Coefficient of thermal expansion |
Approximately 4.5 × 10⁻⁶/K at 20–300°C |
|
Volume resistivity |
≥10¹³ Ω·cm |
|
Dielectric constant at 1 MHz |
8.5–9.0 |
|
Flexural strength |
≥300 MPa |
|
Surface roughness |
Ra ≤0.3 μm for standard substrate finish |
The values above are typical reference data and may vary according to material grade, thickness, manufacturing process, and test method. Grade-specific data should be confirmed before ordering.
Aluminum Nitride Ceramic Substrate
Aluminum nitride (AlN) ceramic substrates combine high thermal conductivity with excellent electrical insulation. They are widely used in power electronics, semiconductor packaging, LED modules, high-frequency devices, and other applications requiring efficient heat dissipation and reliable electrical isolation.
Compared with conventional alumina ceramics, AlN provides substantially higher thermal conductivity. Its relatively low coefficient of thermal expansion also helps reduce thermally induced stress in electronic assemblies. TecCera supplies standard and custom AlN substrates with precision-machined holes, slots, contours, and specified surface finishes.
Key Features
- High thermal conductivity, typically 170–200 W/(m·K) for high-conductivity grades
- Excellent electrical insulation and high volume resistivity
- Relatively low coefficient of thermal expansion
- Good flexural strength and dimensional stability
- Excellent thermal-shock and high-temperature resistance
- Suitable for precision machining and customized geometries
- Available with ground, lapped, polished, or metallized surfaces
Typical Applications
- IGBT and MOSFET power modules
- EV inverters and power-control systems
- LED and semiconductor-laser heat-spreading substrates
- High-power transistor mounting substrates
- Semiconductor packaging components
- High-frequency and microwave devices
- Ceramic heaters, heat sinks, and electrically insulating components
Customization Options
- Custom length, width, and thickness
- Precision-machined holes, slots, steps, and contours
- Laser cutting and drilling
- Surface grinding, lapping, and polishing
- Metallized patterns and copper-bonded structures
- Prototype, small-batch, and volume production
Related AlN Ceramic Products
- Standard and custom AlN ceramic substrates
- Metallized AlN substrates
- Copper-bonded AlN substrates
- AlN ceramic heat sinks and heater components
- Custom AlN structural components
Frequently Asked Questions
Q1: Which provides better heat dissipation, AlN or alumina?
Aluminum nitride typically offers thermal conductivity of 170–200 W/(m·K), while common alumina ceramics generally provide approximately 20–30 W/(m·K). AlN is therefore better suited for high-power applications requiring efficient heat dissipation.
Q2: What is the maximum operating temperature of AlN?
The maximum operating temperature depends on the AlN grade, atmosphere, mechanical load, and duration of exposure. For high-temperature applications, the allowable continuous service temperature should be evaluated according to the actual operating conditions.
Q3: Is AlN a suitable alternative to beryllium oxide?
AlN is commonly used as an alternative to BeO because it provides high thermal conductivity without the beryllium-related health risks. Appropriate dust-control precautions are still required when machining ceramic materials.
Q4: Can you manufacture custom AlN substrates?
Yes. We supply AlN substrates in custom dimensions and geometries, including parts with holes, slots, steps, contours, and specified surface finishes. Send us your drawings and technical requirements for evaluation and quotation.
Contact TecCera for custom aluminum nitride ceramic substrates, technical evaluation, samples, and quotation support.