Custom 96% Alumina Ceramic PCB

TecCera supplies Custom 96% Alumina Ceramic PCB for electronic applications requiring electrical insulation, thermal stability, dimensional accuracy and reliable circuit performance.

This product uses a 96% alumina ceramic substrate with a nominal thickness of 1.0 ± 0.1 mm. The conductor layer is approximately 30 μm, with a silver-based surface metallization.

Alumina ceramic circuit boards are suitable for a wide range of electronic and power applications, including communication modules, automotive electronics, power conversion systems, solid-state relays and high-power LED assemblies.

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Typical Product Specifications

* Thermal conductivity depends on the ceramic composition, grade and test conditions. Final values should be confirmed against the actual material datasheet.

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Key Advantages

Excellent Electrical Insulation

Alumina ceramic provides high electrical insulation and stable dielectric performance, making it suitable for applications involving high voltage, compact circuit layouts and demanding operating conditions.

Its combination of insulation and thermal stability allows designers to integrate electrical isolation and heat dissipation within the same ceramic substrate.

Reliable Thermal Management

Ceramic circuit boards provide significantly better thermal stability than conventional organic PCB materials.

Depending on ceramic composition and grade, typical thermal conductivity of electronic ceramic substrates can range from approximately 20 to 200 W/m·K.

For this 96% alumina configuration, thermal conductivity is typically around 20–30 W/m·K, depending on the actual material grade.

Strong Metallization Adhesion

Ceramic circuit boards can provide strong adhesion between the conductive circuit and the ceramic substrate.

Typical conductor bonding strength can reach:

≥ 20 N/cm²

Actual values depend on metallization system, conductor thickness, ceramic surface condition and manufacturing process.

High Mechanical Stability

Alumina ceramic offers high hardness, compressive strength and dimensional stability.

Typical compressive strength can reach:

≥ 450 MPa

This makes ceramic PCBs suitable for environments involving:

• High temperature
• High humidity
• High voltage
• Corrosive atmospheres
• Thermal cycling
• Long-term continuous operation

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Ceramic Material Options

TecCera can support different ceramic substrate materials depending on thermal, electrical and mechanical requirements.

Typical materials include:

• 96% Alumina (Al₂O₃)
• 99% Alumina
• Aluminum Nitride (AlN)
• Other technical ceramics according to project requirements

Incoming ceramic substrates can be inspected for:

• Surface quality
• Thickness
• Flatness
• Warpage
• Mechanical integrity
• Dimensional accuracy

For export-facing content, I would not write “German imported ceramic” unless you can consistently provide supplier traceability or supporting documentation.

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Precision Processing Capabilities

TecCera can support customized ceramic circuit boards with fine circuit structures and different conductor configurations.

Typical processing capabilities include:

• Fine line / space down to 3 mil / 3 mil
• Conductor thickness: 0.01–0.5 mm
• Microvia structures
• Via filling
• Fine pattern formation
• Complex circuit geometry
• Customized substrate shapes
• Customized metallization patterns
• Single-sided circuit structures
• Double-sided structures where applicable

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Available Substrate Thicknesses

Typical ceramic substrate thickness options include:

• 0.25 mm
• 0.38 mm
• 0.50 mm
• 0.635 mm
• 1.0 mm
• 1.5 mm
• 2.0 mm
• 2.5 mm
• 3.0 mm

Other thicknesses can be evaluated according to drawings and application requirements.

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Surface Finish Options

Different surface finishes can be selected according to soldering, bonding, packaging and environmental requirements.

Typical options include:

• Silver metallization
• Gold plating
• Nickel plating
• Ni/Pd/Au
• Immersion gold
• Immersion tin

Available thickness ranges depend on the specific finishing process and project requirements.

For this page, I would not publish all the “1–30 μin / 1–5 μin / 3–30 μm” values yet unless you confirm the original units. The source material mixes u”, um and different processes, and a unit mistake here would damage credibility with technical buyers.

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