DBC Alumina Ceramic Substrate with Immersion Gold

TecCera supplies DBC Alumina Ceramic Substrate with Immersion Gold for power electronics and high-reliability electronic assemblies requiring thick copper conductors, electrical insulation and efficient heat dissipation.

Direct Bonded Copper (DBC) technology bonds copper directly to an alumina ceramic substrate, creating a robust metal–ceramic structure suitable for high-current and high-power applications.

This typical configuration uses an Al₂O₃ ceramic substrate, 300 μm copper layers, a substrate thickness of 0.38 mm, and an immersion gold surface finish.

Compared with fine-line DPC substrates, DBC is particularly suitable for applications where higher current carrying capacity, thicker copper and power cycling performance are more important than ultra-fine circuit geometry.

⸻

Typical Product Specifications

Note: The source specification describes this product as “2 layers.” For an international technical page, Double-Sided DBC is clearer than calling it a conventional “2-layer PCB.”

⸻

Key Advantages of DBC Alumina Ceramic Substrates

Thick Copper for High-Current Applications

DBC technology supports substantially thicker copper conductors than many fine-line ceramic circuit processes.

With copper thickness such as:

300 μm

the substrate can support high-current paths and improved heat spreading, making it suitable for:

• Power semiconductor modules
• Motor drives
• Power converters
• Industrial power supplies
• Automotive power electronics
• High-current switching applications

⸻

Reliable Thermal Management

Alumina ceramic provides significantly better thermal conductivity than conventional FR-4 circuit board materials.

Typical thermal conductivity for alumina ceramics used in electronic substrates is approximately:

20–30 W/m·K

depending on purity, composition and test conditions.

This allows heat generated by power devices to transfer through the electrically insulating ceramic layer toward a heat sink or cooling structure.

⸻

Excellent Electrical Insulation

Alumina ceramic combines thermal conductivity with high electrical insulation.

Typical dielectric strength can reach approximately:

10–20 kV/mm

depending on ceramic grade, thickness and test method.

This makes alumina DBC substrates useful in systems requiring electrical isolation between semiconductor devices and cooling structures.

⸻

Good Thermal Expansion Compatibility

Typical coefficient of thermal expansion for alumina ceramic is approximately:

7–8 × 10⁻⁶/K

This is significantly lower than many organic PCB materials and helps improve dimensional stability under thermal cycling.

For power semiconductor assemblies, reduced thermal-expansion mismatch can help lower mechanical stress within the package.

⸻

High Mechanical Strength

Alumina ceramic provides:

• High hardness
• Good flexural strength
• Wear resistance
• Dimensional stability
• Good chemical resistance

Typical flexural strength can fall in the range of approximately:

300–400 MPa

depending on alumina purity and ceramic grade.

⸻

Alumina Ceramic Material

DBC substrates can be manufactured using high-purity alumina ceramics selected according to electrical, thermal and mechanical requirements.

Typical grades include:

• 96% Alumina
• 99% Alumina

Key material characteristics include:

• Dense ceramic structure
• Good electrical insulation
• Stable mechanical properties
• Good thermal stability
• Low moisture absorption
• Good resistance to many chemicals
• High surface hardness

The exact ceramic grade should be selected according to operating voltage, thermal load, dimensional requirements and cost target.

⸻

Why Use DBC Technology?

DBC technology forms a strong bond between thick copper and ceramic without using the type of organic dielectric layer commonly found in conventional PCB structures.

This provides several advantages for power electronics:

• Thick copper conductors
• High current carrying capability
• Efficient heat spreading
• Electrical insulation
• Strong copper-to-ceramic bonding
• High-temperature capability
• Good thermal cycling performance
• Stable dimensions

DBC is therefore widely used where conventional FR-4 PCBs or standard metal-core PCBs cannot meet power density and reliability requirements.

⸻

DBC vs DPC

This distinction is important for your website:

DBC should not be positioned as simply another version of DPC.

DBC = power density + thick copper + current handling
DPC = precision circuits + fine lines + packaging

⸻

Surface Finish

This product uses:

Immersion Gold

The surface finish can help improve:

• Solderability
• Surface oxidation resistance
• Contact reliability
• Assembly compatibility

Depending on customer requirements, other finishes may also be evaluated.

For technical quotations, surface-finish type and thickness should be specified according to the actual assembly process.

⸻

Custom DBC Processing Capabilities

TecCera can support customized DBC ceramic substrates according to customer drawings.

Typical customization includes:

• Ceramic material
• Ceramic thickness
• Copper thickness
• Single-sided or double-sided copper
• Circuit geometry
• Substrate dimensions
• Surface finish
• Hole and slot design
• Copper edge geometry
• Custom outlines
• Prototype and production quantities

⸻

Typical Alumina Thickness Options

Common ceramic substrate thicknesses can include:

• 0.25 mm
• 0.32 mm
• 0.38 mm
• 0.50 mm
• 0.635 mm
• 1.0 mm

Other thicknesses can be evaluated according to project requirements.

⸻