Ceramic PCB & Substrates
Double-Sided DPC Ceramic Copper Substrate
Double-sided DPC ceramic copper substrate made from 96% alumina, featuring 300 μm copper, gold-plated surface, and good thermal conductivity for high-power LED and power module applications
Description
TecCera supplies double-sided ceramic copper substrates manufactured using the DPC (Direct Plated Copper) process for high-power electronic and thermal management applications.
The substrate uses 96% alumina ceramic as the insulating base material, combined with thick copper metallization on both sides and optional gold surface finishing. This structure provides good electrical insulation, thermal conductivity, dimensional stability, and current-carrying capability.
It is suitable for applications such as high-power LED modules, power modules, electronic packaging, and other high-heat-flux devices.
Technical Specifications
|
Parameter |
Specification |
|
Number of Layers |
2 Layers |
|
Ceramic Thickness |
0.635 ± 0.05 mm |
|
Ceramic Material |
96% Alumina (Al₂O₃) |
|
Surface Finish |
Gold Plating |
|
Ceramic Thermal Conductivity |
Approx. 30 W/m·K |
|
Outer Copper Thickness |
300 μm |
|
Gold Thickness |
≥ 3 μin |
|
Manufacturing Process |
DPC |
|
Structure |
Double-Sided Copper |
|
Customization |
Available according to drawings and application requirements |
Key Features
DPC Process
The Direct Plated Copper (DPC) process allows copper layers to be formed directly on the ceramic substrate, enabling precise circuit patterns and good adhesion between the copper layer and alumina ceramic.
Thick Copper Layer
With an outer copper thickness of 300 μm, the substrate is suitable for applications requiring higher current capacity and improved heat spreading.
96% Alumina Ceramic
The 96% alumina ceramic substrate provides:
- Good electrical insulation
- Stable mechanical properties
- Good thermal conductivity
- Reliable dimensional stability
- Compatibility with thick-film and plated copper structures
Gold-Plated Surface
The gold-plated finish provides a stable contact surface and helps improve oxidation resistance and bonding performance for selected assembly processes.
Double-Sided Structure
Copper patterns can be formed on both sides of the ceramic substrate, supporting more flexible circuit design, interconnection, thermal spreading, and power packaging structures.
Typical Applications
Double-sided DPC ceramic copper substrates are suitable for:
- High-power LED modules
- Power modules
- Power semiconductor packaging
- IGBT and MOSFET modules
- Laser diode modules
- RF and microwave devices
- Automotive power electronics
- Industrial power supplies
- High-power electronic assemblies
- Thermal management applications
Custom DPC Ceramic Substrates
TecCera can support customized DPC ceramic substrates according to customer drawings and technical requirements, including:
- Ceramic thickness
- Copper thickness
- Copper pattern
- Substrate dimensions
- Surface finish
- Gold plating thickness
- Double-sided circuit layout
- Custom pads and metallization areas
Customers are welcome to provide drawings, Gerber files, samples, or technical specifications for evaluation.
How to Get a Quote
Send us your drawing or technical requirements. We will review the material, dimensions, tolerances and application conditions before quotation.
- Inquiry
- Technical Review
- Quotation
- Order
Need a Custom Ceramic Component?
Send us your drawing, dimensions, material requirements, quantity and application conditions.
Request a Quote