DPC Aluminum Nitride Ceramic PCB Substrate

• Power semiconductor modules
• High-power LEDs
• RF power devices
• Laser components
• Automotive power electronics
• High-density electronic packaging

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Excellent Electrical Insulation

Although aluminum nitride provides high thermal conductivity, it remains an excellent electrical insulator.

This combination of:

• High thermal conductivity
• High dielectric strength
• Electrical isolation
• Low thermal expansion

makes AlN particularly useful in applications where electrical insulation and heat dissipation must be achieved simultaneously.

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Strong Copper-to-Ceramic Bonding

DPC technology allows copper circuits to be formed directly on the ceramic substrate.

Typical conductor bonding strength can reach:

≥ 20 N/cm²

Strong metal-to-ceramic adhesion supports stable performance under thermal cycling and long-term operation.

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High Mechanical and Dimensional Stability

Aluminum nitride ceramic provides good mechanical strength and dimensional stability under demanding operating conditions.

Ceramic substrates can maintain stable electrical and mechanical properties under:

• High temperature
• High humidity
• High voltage
• Thermal cycling
• Corrosive environments

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Why Use Aluminum Nitride for DPC Ceramic PCBs?

Compared with conventional organic PCB materials, aluminum nitride provides a combination of thermal, electrical and mechanical properties that is difficult to achieve with polymer-based substrates.

Key advantages include:

• High thermal conductivity
• Electrical insulation
• Low dielectric loss
• Good dimensional stability
• Low coefficient of thermal expansion
• High-temperature resistance
• High mechanical strength
• Good compatibility with semiconductor packaging processes

For applications where heat dissipation is the main design constraint, AlN can provide a significant advantage over standard alumina ceramic substrates.

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Precision DPC Processing Capabilities

TecCera can support customized DPC ceramic substrates with fine circuit structures and different copper configurations.

Typical capabilities include:

• Fine line / space down to 3 mil / 3 mil
• Copper thickness from 0.01 mm to 0.5 mm
• Microvia structures
• Via filling
• Through-hole structures
• Fine copper patterning
• Double-sided circuit designs
• Complex circuit geometry
• Custom ceramic shapes
• Custom metallization patterns
• 3D circuit structures where applicable

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Available Substrate Thicknesses

Typical ceramic substrate thickness options include:

• 0.25 mm
• 0.38 mm
• 0.50 mm
• 0.635 mm
• 1.0 mm
• 1.5 mm
• 2.0 mm
• 2.5 mm
• 3.0 mm

Other thicknesses can be evaluated according to drawings and application requirements.

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Surface Finish Options

Different surface finishes can be selected according to soldering, bonding and packaging requirements.

Typical options include:

• Immersion gold
• Gold plating
• Nickel plating
• Ni/Pd/Au
• Silver plating
• Immersion tin

Surface finish thickness can be customized based on customer specifications and application requirements.

For this specific configuration:

Surface Finish: Immersion Gold
Gold Thickness: ≥ 3 μin

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Material Options

TecCera supports different ceramic substrate materials depending on thermal and electrical requirements.

Typical options include:

• Aluminum Nitride (AlN)
• 96% Alumina (Al₂O₃)
• 99% Alumina
• Other technical ceramic materials upon request

For applications requiring maximum thermal conductivity, AlN is usually preferred over standard alumina substrates.

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DPC aluminum nitride ceramic PCB substrates are suitable for electronic systems requiring high thermal conductivity, electrical insulation and high circuit reliability.

Power Electronics

• IGBT modules
• MOSFET modules
• Power converters
• Rectifier modules
• Switching power supplies
• DC-AC converters
• AC-DC converters

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High-Power LED

• High-power LED packages
• COB LED modules
• Automotive LED lighting
• UV LED modules
• Industrial lighting
• High-brightness LED assemblies

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Automotive Electronics

• Automotive power control modules
• EV power electronics
• Ignition systems
• Motor control modules
• Automotive sensors
• Lighting control systems

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RF & Communication

• RF power modules
• Communication electronics
• Antenna modules
• Microwave circuit assemblies
• High-frequency electronic devices

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Solid-State Relays

AlN ceramic PCB substrates can provide both thermal management and electrical insulation for:

• Solid-state relay modules
• Switching devices
• Power control systems
• Industrial automation electronics

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Laser & Optoelectronics

• Laser diode packages
• Optical communication modules
• Photonic devices
• Precision optoelectronic assemblies

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Quality Control

DPC ceramic PCB substrates can be inspected throughout the manufacturing process according to customer drawings and technical requirements.

Typical inspection items include:

• Ceramic substrate appearance
• Thickness
• Flatness
• Warpage
• Hole dimensions
• Circuit dimensions
• Copper thickness
• Surface finish
• Metallization quality
• Circuit continuity
• Dimensional accuracy
• Final visual inspection

Microscope inspection up to 100× magnification can be performed where required by the project specification.

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Quality Management

Manufacturing and inspection can be carried out under established quality management procedures according to customer and project requirements.

If applicable and supported by valid certificates, manufacturing quality systems may include:

• ISO 9001
• IATF 16949

Do not state these as TecCera certifications unless the certification scope legally covers TecCera itself.

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Custom DPC Aluminum Nitride Ceramic PCB

TecCera supports customized DPC ceramic substrates based on customer drawings and technical requirements.

For quotation, customers can provide:

• Ceramic material
• Substrate dimensions
• Substrate thickness
• Layer count
• Copper thickness
• Minimum line / space
• Hole diameter
• Circuit drawing
• Surface finish
• Quantity
• Application
• Special inspection requirements

Send us your Gerber file, drawing or technical specifications for evaluation and quotation.

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Request a Quote

Need a custom DPC aluminum nitride ceramic PCB substrate?

TecCera can support prototype and production requirements for power electronics, LED, RF, automotive and industrial electronic applications.

We can evaluate:

• Ceramic material selection
• Substrate thickness
• Copper thickness
• Circuit geometry
• Hole structure
• Surface finish
• Thermal management requirements
• Prototype and production quantities