DPC Aluminum Nitride Ceramic Substrate

TecCera supplies DPC aluminum nitride ceramic substrates for high-power and high-reliability electronic applications.

Using Direct Plated Copper (DPC) technology, fine copper circuits can be formed directly on aluminum nitride ceramic substrates, providing an effective combination of thermal management, electrical insulation, dimensional stability, and precision circuit capability.

Aluminum nitride ceramic substrates are suitable for applications where efficient heat dissipation and reliable electrical insulation are critical, including power modules, high-power LEDs, automotive electronics, RF devices, and optoelectronic components.

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Key Advantages

High Thermal Conductivity

Ceramic substrate materials can provide thermal conductivity ranging from approximately 20 to 200 W/m·K, depending on the selected ceramic material and grade.

Aluminum nitride is particularly suitable for applications requiring efficient heat transfer from high-power electronic components.

Excellent Electrical Insulation

Ceramic substrates provide high dielectric strength while maintaining good thermal performance, making them suitable for high-voltage and high-power electronic systems.

Strong Copper Adhesion

DPC processing provides strong adhesion between the copper circuit layer and the ceramic substrate.

Typical conductor bonding strength can reach:

≥ 20 N/cm²

Actual values depend on material, copper thickness, surface treatment, and design requirements.

Fine Surface Quality

Typical ceramic substrate surface roughness can be controlled within:

Ra 0.2–0.7 μm

This helps support fine circuit patterning and reliable metallization.

High Mechanical Stability

Ceramic substrates provide high mechanical strength and dimensional stability.

Typical compressive strength can reach:

≥ 450 MPa

They are suitable for applications exposed to high temperature, humidity, voltage, and other demanding operating environments.

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Available Ceramic Materials

TecCera can support different ceramic substrate materials according to thermal, electrical, and mechanical requirements.

Typical options include:

• Aluminum Nitride (AlN)
• 96% Alumina (Al₂O₃)
• Other ceramic substrate materials according to project requirements

Material selection should be based on thermal conductivity, dielectric properties, mechanical strength, substrate thickness, circuit geometry, and operating environment.

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DPC Processing Capabilities

Our DPC ceramic substrate solutions can support fine circuit structures for electronic packaging and thermal management applications.

Typical capabilities include:

• Fine circuit capability down to 3 mil / 3 mil
• Copper conductor thickness: 0.01–0.5 mm
• Microvia and via filling
• Fine circuit patterning
• Complex circuit structures
• Customized ceramic substrate dimensions
• Single-sided and double-sided circuit designs
• Custom copper thickness according to application requirements

Available Substrate Thicknesses

Typical ceramic substrate thickness options include:

• 0.25 mm
• 0.38 mm
• 0.50 mm
• 0.635 mm
• 1.0 mm
• 1.5 mm
• 2.0 mm
• 2.5 mm
• 3.0 mm

Other thicknesses may be available upon request.

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Surface Finish Options

Different surface finishes can be supplied according to soldering, wire bonding, brazing, packaging, and environmental requirements.

Typical options include:

• Gold plating
• Ni/Pd/Au
• Silver plating
• Nickel plating
• Immersion gold
• Immersion tin

Surface finish thickness can be customized according to customer drawings and technical requirements.

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Typical Product Specifications

Note: Specifications shown above represent one typical configuration. Ceramic material, dimensions, copper thickness, circuit pattern, surface finish, and other parameters can be customized.

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