DPC Gold-Plated Alumina Ceramic Substrate

TecCera supplies custom DPC gold-plated alumina ceramic substrates for precision electronic packaging and high-reliability circuit applications.

Using Direct Plated Copper (DPC) technology, copper circuits are formed directly on the ceramic substrate, enabling fine circuit geometries, good dimensional stability and reliable electrical insulation.

A gold surface finish can then be applied to selected copper areas to improve oxidation resistance, solderability, wire-bonding compatibility and long-term contact reliability.

This configuration uses an alumina ceramic substrate, 35 μm copper circuits, and a gold-plated surface finish.

⸻

Typical Product Specifications

⸻

Key Advantages

Fine Circuit Capability

DPC technology is suitable for precision ceramic circuits requiring smaller line widths and tighter circuit spacing than conventional thick-film ceramic circuits.

Depending on the design and manufacturing process, DPC can support:

• Fine copper traces
• High-density circuit layouts
• Small bonding pads
• Through-hole and via structures
• Double-sided interconnection
• Customized conductor geometries

For applications requiring very fine features, line width and spacing should be confirmed according to the actual drawing.

⸻

Excellent Electrical Insulation

Alumina ceramic provides reliable electrical insulation while maintaining good thermal and mechanical stability.

This makes DPC alumina ceramic substrates suitable for applications requiring separation between electrical circuits and thermally conductive structures.

⸻

Reliable Copper-to-Ceramic Bond

DPC processing creates a direct metallized circuit structure on the ceramic surface.

Key benefits include:

• Good copper adhesion
• Stable circuit geometry
• Fine metallization patterns
• Compatibility with precision electronic packaging
• Reliable performance under thermal cycling

⸻

Benefits of Gold Plating

Gold plating is frequently used on ceramic circuit substrates when reliable electrical contact and packaging compatibility are required.

Oxidation and Corrosion Resistance

The gold surface helps protect the underlying metallization from oxidation and environmental degradation.

This is particularly useful for electronic components that must remain electrically stable during storage, assembly and long-term operation.

⸻

Improved Electrical Contact

Gold provides a stable contact surface with low and predictable contact resistance.

It is commonly used for:

• Bonding pads
• Contact pads
• Semiconductor test interfaces
• Sensor electrodes
• RF contact areas

⸻

Wire Bonding Compatibility

Gold-finished surfaces can support gold wire bonding and other packaging processes when the plating structure, thickness, surface cleanliness and roughness meet the corresponding bonding requirements.

Final wire-bond performance should be validated according to the specific package design and bonding process.

⸻

Soldering and Die-Attach Compatibility

Depending on the complete metal stack and assembly process, gold-finished ceramic substrates can be used with:

• Soldering
• Brazing
• Die attach
• Flip-chip assembly
• Wire bonding

The exact finish should be selected according to the solder alloy, bonding material and operating temperature.

⸻

Precision DPC Processing Capabilities

TecCera can support customized DPC ceramic substrates according to customer drawings and application requirements.

Typical capabilities include:

• Fine-line copper circuits
• Copper thickness from approximately 0.01 to 0.5 mm
• Microvia structures
• Via filling
• Laser-drilled holes
• Double-sided circuits
• Multilevel interconnection where applicable
• Customized ceramic outlines
• Custom pad geometry
• Selective metallization
• Customized gold-plated areas

⸻

Available Substrate Thicknesses

Typical ceramic substrate thickness options include:

• 0.25 mm
• 0.38 mm
• 0.50 mm
• 0.635 mm
• 1.0 mm
• 1.5 mm
• 2.0 mm
• 2.5 mm
• 3.0 mm

Other thicknesses can be evaluated according to application and drawing requirements.

⸻

Gold Plating Options

Gold finish requirements can vary significantly depending on whether the substrate is designed for soldering, wire bonding, die attach or electrical contact.

Typical parameters that can be customized include:

• Gold plating thickness
• Nickel / gold metal stack
• Selective gold plating
• Bondable gold finish
• Contact-area gold plating
• Surface roughness
• Plating coverage

For precision packaging projects, the required gold thickness and underlying metal stack should be specified on the drawing.

⸻