Ceramic PCB & Substrates
Round DPC Alumina Ceramic Substrate with Gold Plating
Custom DPC alumina ceramic substrate with 0.635 mm alumina, 35 μm copper and ≥3 μm gold plating for precision electronic packaging applications.
Product Description
TecCera supplies precision DPC alumina ceramic substrates for electronic packaging, power electronics, optoelectronics, sensors and high-density circuit applications.
This custom substrate is manufactured from 0.635 mm alumina ceramic using Direct Plating Copper (DPC) technology, with approximately 35 μm copper thickness and a gold-plated surface finish ≥3 μm.
The fine circuit pattern and compact circular geometry make it suitable for applications requiring electrical insulation, dimensional stability, thermal management and precision metallization.
Circuit layout, substrate thickness, copper thickness, surface finish and dimensions can be customized according to customer drawings.
Technical Specifications
|
Parameter |
Specification |
|
Product Type |
DPC Alumina Ceramic Substrate |
|
Substrate Material |
Alumina (Al₂O₃) |
|
Number of Layers |
1 |
|
Substrate Thickness |
0.635 mm |
|
Copper Thickness |
35 μm |
|
Manufacturing Process |
DPC – Direct Plating Copper |
|
Surface Finish |
Gold Plating |
|
Gold Thickness |
≥ 3 μm |
|
Dimensions |
18.77 × 19.48 mm |
|
Product / Drawing No. |
12769 |
|
Circuit Pattern |
Custom |
|
Shape |
Round / Customized |
Key Features
Precision DPC Circuit Formation
DPC technology enables fine copper patterns and localized metallization directly on the ceramic substrate.
Electrical Insulation & Thermal Management
Alumina combines electrical insulation with useful thermal conductivity for electronic packaging applications.
35 μm Copper Layer
The copper circuit provides electrical interconnection while maintaining a compact substrate structure.
Gold-Plated Surface
Gold plating can improve oxidation resistance and provide a suitable surface for selected bonding and interconnection processes.
Custom Circuit Geometry
Trace layout, pads, holes, substrate dimensions and metallization patterns can be manufactured according to customer drawings.
Typical Applications
- Power semiconductor packaging
- LED and laser diode modules
- RF and microwave circuits
- Sensors and detector modules
- Optoelectronic devices
- Electronic packaging
- High-density ceramic circuits
- Customized electronic modules
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Custom Options
TecCera supports custom DPC ceramic substrates according to customer drawings and application requirements.
- Alumina or AlN substrate
- Substrate thickness
- Copper thickness
- Circuit pattern
- Pad geometry
- Through holes / vias
- Gold plating
- Nickel/gold surface finish
- Outer dimensions
- Tolerance
- Prototype and batch quantities
Request a Quote
Need a custom DPC ceramic substrate?
Send us your Gerber file, drawing, substrate material, copper thickness, surface finish and quantity. TecCera can evaluate the DPC structure and manufacturing requirements for your application.
⸻
How to Get a Quote
Send us your drawing or technical requirements. We will review the material, dimensions, tolerances and application conditions before quotation.
- Inquiry
- Technical Review
- Quotation
- Order
Need a Custom Ceramic Component?
Send us your drawing, dimensions, material requirements, quantity and application conditions.
Request a Quote